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Source RF sputtering equipment - メーカー・企業と製品の一覧

Source RF sputtering equipmentの製品一覧

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Multi-source RF sputtering device with glove box

A research membrane environment that aims to eliminate oxygen and moisture! Supports multilayer membranes, compound membranes, and reactive membranes!

This product is a sputtering device for the development of batteries, catalyst materials, and organic devices. It connects a load lock chamber and a glove box to the sputtering chamber. It can accommodate four UHV-compatible sputter cathodes. Additionally, it supports multilayer films, compound film deposition, and reactive film deposition. 【Features】 ■ For the development of batteries, catalyst materials, and organic devices ■ Connects a load lock chamber and a glove box to the sputtering chamber ■ Can accommodate four UHV-compatible sputter cathodes ■ Research film deposition environment that eliminates oxygen and moisture ■ Supports multilayer films, compound film deposition, and reactive film deposition *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

4-inch 3-source RF sputtering device

The substrate dimensions can accommodate up to 3 pieces with a maximum size of 3 inches! It is equipped with a heating mechanism and a reverse sputtering mechanism!

This product is a 3-source RF magnetron sputtering system designed for metal and insulating materials. The substrate features a heating mechanism and a reverse sputtering mechanism. The sputter cathodes consist of three φ4-inch magnetron cathodes, and the substrate insertion is designed for manual opening and closing of the top cover. 【Features】 ■ Substrate size: Maximum 3 inches (can accommodate 3 pieces) ■ Substrate holder: Substrate heating up to 500°C, substrate rotation, and reverse sputtering mechanism included ■ Sputter cathodes: Three φ4-inch magnetron cathodes ■ Gas system: Two systems of Ar and O2 MFC ■ Substrate insertion: Manual opening and closing of the top cover *For more details, please refer to the PDF document or feel free to contact us.

  • Sputtering Equipment

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録